Paste BGA On PCB SMT Assembly Machine Placement Of Small Components
Juki KE-2070L SMT Machine Suitable for high-speed placement of small components
Used Juki KE-2070 smd equipment 23300CPH laser identification/condition
6 suction nozzles JUKI2070 SMT Assembly Machine Fast Speed For 1.2m PCB LED Strip
Used Juki KE-2070 Smd assembly machine Paste Bridge pile Convex lens on PCB
Shenzhen Wanbo High-tech Co., Ltd. has a JUKI senior engineer team with rich maintenance experience, specializing in providing JUKI series placement machine software and hardware maintenance and troubleshooting. It mainly includes JUKI laser head, CPU motherboard SUB-CPU board, drive board X/Y/Z/T axis driver, head board, image control card, I/O board, JUKI servo motor, camera, display touch screen, servo motor and other maintenance and replacement services. The company's fees are reasonable, the warehouse accessories are sufficient, the maintenance cycle is short, the one-time repair success rate is high, and the Pearl River Delta region can provide door-to-door installation, commissioning, maintenance and maintenance.
①Monitor:This is a monitor for teaching operation. Itdisplays an image shot by a camera.
②LCD:This is a liquid crystal monitor. It displays each operation screen.
③Operation:This is a collection of switches that operatepanelthe machine. (See "Operation panel"below.)
④Safety cover:When you open this cover while thecovermachine is operating during PWB production, the machine stops immediatelyor stops after it moves its devices to thedesired positions respectively. When youoperate the machine although this coveropens, the machine operates at low speed.
⑤Keyboard Mouse :These devices operate each screen displayed on the LCD.
Operations of these devices are similar withthose of a personal computer.
⑥Main switch:This switch turns on or off the power of the machine.
⑦HOD:This device positions an image shot by a camera (that is teaching operation).
| Model name | High speed placement machine KE-2070M/L/E |
| Substrate size | M substrate (330×250mm) ○ l For substrate (410×360mm) ○ E substrate (510×460mm) ○ |
| Element height | 6mm specifications ○ 12mm specifications ○ 20mm Specifications _ 25mm Specifications _ |
| Component size | Laser identification 0402 (imperial 01005) chip ~ 33.5mm square element Image recognition 1.0×0.5mm~33.5mm square element |
| Component placement speed | Optimal conditions 0.155 sec/chip (23300CPH) IC Component 4600CPH* |
| Component placement accuracy | Laser recognition ±0.05mm Image recognition ±0.04mm |
| Component placement type | Up to 80 types (converted to 8mm belt) |
| power supply | Three-phase AC200~415V |
| Rated power | 3KVA |
| Use air pressure | 0.5±0.05Mpa |
| Air consumption | (Standard status) 345L/min |
| Device size (W×D×H) | M substrate 1,400×1,393×1,455mm L substrate 1,500×1,500×1,455mm E substrate 1,730×1,600×1,455mm |
| weight | 1530kg |
Accessories include: all kinds of original, domestic nozzles, FEEDER, boards, lasers, solenoid valves, inductors,
cylinders, tank chains, etc.), laser maintenance, board maintenance and so on.
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